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Heat Sink Compound

Heat Sink Compound
Heat Sink Compound
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Product Code : HSC 01
Product Description

Heat Sink Compound are low-bleed stable thermal compound. They have exceptional thermal conductivity which increases the typical performance of stock thermal compound. They can transfer heat from thermal coupling of electrical / electronic devices to heat sinks. They are mostly used in microprocessor, computers, laptops, Xbox, etc. They can also be used as a non-flammable coating for fly back in transformer connections in TV etc.
Further our product is bleed resistant, non-melt, non-drying, and non-curing in nature & can
bear upto 2000 C.

Product features:

  • Capable of high thermal conductivity
  • Bleed resistant, non-drying, non-melt and non-curing in nature.
  • Heat – resistant up 2000 C.
Applications

Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers.

Also used as a non-flammable coating for fly back transformer connections in TV chassis and similar applications.

Packing

2 kg.


ISOL INDUSTRIES
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ISOL INDUSTRIES
J-63/1, Site-V Industrial Area, Kasna, Greater Noida - 201308, Uttar Pradesh, India
Phone :+918068096435
Mr. Jaivir Singh (Proprietor)
Mobile :+918068096435

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