Heat Sink Compound are low-bleed stable thermal compound. They have exceptional thermal conductivity which increases the typical performance of stock thermal compound. They can transfer heat from thermal coupling of electrical / electronic devices to heat sinks. They are mostly used in microprocessor, computers, laptops, Xbox, etc. They can also be used as a non-flammable coating for fly back in transformer connections in TV etc.
Further our product is bleed resistant, non-melt, non-drying, and non-curing in nature & can
bear upto 2000 C.
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers.
Also used as a non-flammable coating for fly back transformer connections in TV chassis and similar applications.